
Here's your chance to win some cool stuff for all that stalker purely hypothetical 007-inspired equipment you've been dreaming up (make sure it's in a native Autodesk file format). Prizes for Autodesk's Spy Gadget Design Contest will be awarded for Top Overall Design, Most Creative Design, and Best Use of Member Content. The Top Overall Design winner gets a sweet Sony James Bond 007 TX Spy Gear bundle which includes a VAIO TX notebook PC, a privacy screen, and Cyber-shot digital camera--all bundled up in (what else?) a slick Bond-esque briefcase. Other prizes include a Zune, Cyber-shot phone, and Vault Micro Vault 1GB Flash Drives. Hurry up because submissions won't be accepted after April 18, 2007.
MILAN DESIGN WEEK 2009
PICTOPIA FESTIVAL 2009
HOME AND HOUSEWARES SHOW 2009
TRANSVERSALE 2009
NEW YORK CITY TOY FAIR 2009
IMM COLOGNE INTERNATIONAL FURNISHING SHOW
NORTH AMERICAN INT'L AUTO SHOW '09
TOKYO DESIGN WEEK 2008
LONDON DESIGN FESTIVAL 2008
NeoCon 2009
MD&M East and ATX 2009
Nidecker Snowboard Design Competition
Tools of Engagement
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